Intel Corporatio​n seeking PhD candidates & recent PhD graduates

Greetings,

The Portland Technology Development group’s Thin Films division of  Intel Corporation has several openings for physical science Ph.D.s to support/direct R&D of advanced processing methods. Candidates hired for these positions will be responsible for developing the next generation of Intel’s  microprocessors.

 Ph.D. candidates in Materials Science,  Chemistry, Chemical Engineering, Physics, Electrical  Engineering or related fields are encouraged to apply.  Criteria for selection include: a strong academic record, demonstrated experimental and data analysis expertise, superior critical thinking skills, an ability to drive and take responsibility for projects and a solid peer-reviewed publication record. Experience using and maintaining scientific equipment is preferred. Semiconductor processing experience is not mandatory. Openings are immediately available at Intel’s primary development facility (Ronler Acres) located ~10 miles west of Portland, OR. Please see a more detailed job description included below.

Interested candidates should email resumes to  travis.j.hebden@intel.com with “Intel Corporation Hiring” included in the subject line.

 Travis J. Hebden, PhD

PTD Process Engineer

Intel Corporation

PTD Module & Integration Yield  Engineer

 Description

PTD Module Engineers are responsible for leading scientific research and enabling manufacture of innovative device architectures coupled with the realization of these architectures. Responsibilities include designing,  executing and analyzing experiments necessary to meet  engineering specifications for the process. A Module Engineer participates in the development of intellectual property and the development of the equipment necessary to exploit    understanding gained in research (in collaboration with equipment suppliers.) The Engineer must work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues and operate the manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex microprocessors. Module Engineers are also responsible for overseeing in-situ ramp to manufacturing volumes to demonstrate that the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via ‘Copy Exactly!’ methodology. Module ownership includes the install and qualification of manufacturing capacity at the development site and audit installation/qualification and supervision of first full loop at the production site.  

 Qualifications

You must possess a minimum of a Ph.D. degree majoring in Physics, Material Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or Chemistry.
Additional qualifications include:

Demonstrate experience in keen experimental insight

Demonstrate experience to devise and focus on key experiments

 Job Category

Engineering

Primary Location

USA-Oregon, Hillsboro

Posting Date

September 15th, 2013

Apply Before: December 15th, 2013

 Business Group

As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor  manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to          final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.

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