Intel Corporation seeking PhD candidates & recent PhD graduates

The Technology Development group’s Thin Films division of Intel Corporation currently has openings for physical science and engineering Ph.D.s to support/direct R&D of advanced processing methods. Candidates hired for these positions will be responsible for developing the next generation of Intel’s microprocessors.

The PTD Module & Integration Device Yield Engineer’s role encompasses ownership of critical technology, enabling rapid miniaturization in the semiconductor industry and the mass production of integrated circuits. Engineers within the Portland Technology Development (PTD) organization at Intel participate in leading edge innovations in the development of the fabrication process and continue to overcome seemingly impossible barriers as tolerances and specifications for building best-in-class computing devices becomes increasingly rigorous.  Our world-class team consists of passionate, talented, accomplished scientists and engineers who hail from a diverse range of educational, cultural and technological backgrounds. We foster strong collaborations within large groups of process and design engineers as well as with equipment suppliers from all over the world. Our pursuit of increasingly efficient, powerful, tiny devices seek to enable smarter, connected economies toward the enrichment of people around the globe.  If you are considering a career which places you at the leading edge of technological innovation with the world’s foremost semiconductor manufacturer, we encourage you to consider joining the team that is chartered with continuing to meet the challenge of Moore’s Law in the 21st century.

A key challenge in this pursuit of a superior microfabrication processes is the development of next generation optical and computational methods to enable precision measurements and finer control in increasingly complex device interfaces. In addition to students interested in the process development role detailed above, those with experience in optics and big-data manipulation are encouraged to consider applying as well.  In this role, you will be tasked specifically with developing new optical methods as well as designing advanced algorithms that enable state-of-the-art process control systems in semiconductor manufacturing. This emerging team actively collaborates with various process, yield, automation and module engineers within Intel to utilize the latest advances in Artificial Intelligence (AI) and deliver unprecedented robust control to Intel’s manufacturing process.

Criteria for selection include for all candidates: a strong academic record, demonstrated experimental and data analysis expertise, superior critical thinking skills, and an ability to drive and to take responsibility for projects. Experience using and maintaining scientific equipment is valued. Semiconductor processing experience is not mandatory.  Those candidates specifically interested in optics and big data applications will be selected according to criteria including: data acquisition and analysis expertise in experimental research or, demonstrated real-world modeling and computational expertise in theoretical research, strong fundamental understanding of light-matter interaction in the microscopic and atomic regime, strong grasp of at-least one of the modern general all-purpose analytical programming languages such as Python, Matlab, SAS, JMP, R, C, C++, FORTRAN, etc.  Additional desired qualifications for the optics and big data application role include demonstrated coding evidence through Github or similar platform, experience in latest machine learning technologies or experience in optical measurements, spectroscopy, signal processing, manipulation and analysis.

Openings are immediately available at Intel’s primary development facility (Ronler Acres) located ~10 miles west of Portland, OR.

Interested candidates should email resumes to

Jojo Amonoo, Ph.D.

Intel Corporation


PTD Module & Integration Device Yield Engineer – JR0001698


PTD Module Engineers are responsible for leading scientific research and enabling manufacture of innovative device architectures coupled with the realization of these architectures. Responsibilities include designing, executing and analyzing experiments necessary to meet engineering specifications for their process. A Module Engineer participates in the development of intellectual property and the development of the equipment necessary to exploit understanding gained in research (in collaboration with equipment suppliers.) The Engineer must work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues and operate the manufacturing line in order to integrate the many individual steps necessary for the manufacture of complex microprocessors. Module Engineers are also responsible for overseeing in-situ ramp to manufacturing volumes to demonstrate that the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via ‘Copy Exactly!’ methodology. Module ownership includes the install and qualification of manufacturing capacity at the development site and audit installation/qualification and supervision of first full loop at the production site. Must hold a PhD.


You must possess a minimum of a Ph.D. degree majoring in Physics, Material Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or a related field.


Criteria for selection include: a strong academic record, demonstrated experimental and data analysis expertise, superior critical thinking skills, excellent written and verbal communication skills, creativity and flexibility to thrive under changing priorities, strong teamwork skills, an ability to drive and take responsibility for projects and a solid peer-reviewed publication record. Experience using and maintaining scientific equipment is preferred. Semiconductor processing experience is not mandatory.


Job Category


Primary Location

USA-Oregon, Hillsboro

Full/Part Time

Full Time

Posting Date

August 2016

Apply Before

December 2017

Business Group

As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.


Posting Statement

Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status


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